Divers

  • Sony Announces SF-G UHS-II SD Cards: Up to Nearly 300 MB/s Read/Write Performance (AnandTech)

    Sony has announced its new lineup of SD cards for advanced 4K/8K, DSLR, and mirrorless cameras. The new SF-G-series memory cards use the UHS-II bus and one of Sony’s proprietary technologies to offer the company's highest read/write performance to date — up to nearly 300 MB/s. The cards will hit the market in the coming months.

    The Sony SF-G-series memory cards will be available in 32 GB (SDHC), 64 GB (SDXC), and 128 GB (SDXC) configurations. The key selling point of the new Sony SF-G cards is their performance: up to 300 MB/s read speed and up to 299 MB/s write speed, which a quick look finds is around 15% faster compared to competing products (such as the SanDisk Extreme PRO SD UHS-II or the Lexar Professional 2000x UHS-II, both of which offer up to 260 MB/s writes). The new cards from Sony are compatible with various types of SD-supporting devices (cameras, card readers, etc.), but to take full advantage of their speed one needs a device that fully supports the UHS-II bus and has the extra pins the wider bus requires.

    Sony is not reveaing how they're getting up to 299 MB/s sequential write performance in an SD card, instead only saying that it is enabled by its firmware. One possibility is that the cards use NAND flash memory with very large block sizes (supported by the SD 5.0 standard), which helps to boost write performance. In addition, the NAND controller inside the card may have a special pSLC cache with very fast writes and rather low usable capacities of the devices imply on that, but this could be verified only by testing one of these products.

    Sony UHS-II SD Cards at Glance
      32 GB
    SF-G32
    64 GB
    SF-G64
    128 GB
    SF-G128
    Usable Capacity 28.8 GB 57.6 GB 115.2 GB
    Read Speed up to 300 MB/s
    Write Speed up to 299 MB/s
    Minimum Sequential Write Speed 30 MB/s
    Interface UHS-II
    Availability Spring 2017
    SDA Labels UHS-II, Class 10, U3

    The new cards from Sony carry the Class 10 and U3 labels to show that their performance does not drop below 10 and 30 MB/s when used with those standards' respective workloads. Being positioned for professional use, the Sony SF-G cards are also waterproof, static-proof, temperature-proof, and shock-proof, which is beneficial for people who travel a lot and/or have to use memory cards in tough conditions. In case the data on cards is lost, Sony supplies its File Rescue tool with them.

    Sony’s SF-G-series SDXC cards will be available this spring. Pricing is to be determined, but it will vary depending on capacities. In addition to the flash memory cards, Sony will also offer its clients a UHS-II-capable MRW-S1 card reader with USB 3.0 interface, whose price is also unknown.

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  • Chine: le marché des smartphones toujours en forte croissance avec un Apple déclinant (MacBidouille)

    Canalys a publié ses chiffres pour les ventes de smartphones en Chine lors du quatrième trimestre 2016 et fait un bilan de l'année.
    Ce marché reste en forte croissance avec un volume de vente de 131,6 millions d'unités pour le quatrième trimestre 2016 et un volume annuel de 476,5 millions d'unités, soit une hausse par rapport à 2015 de 11,4%.

    Dans ce contexte haussier, Apple recule à la cinquième place des fabricants en ayant écoulé 43,8 millions d'iPhones. Xiaomi lui a pris la quatrième place malgré le fait que ce fabricant ait aussi subi une forte contraction de ses ventes.

    Il faudra réellement qu'Apple creuse un fossé avec ses concurrents lors de la sortie de son prochain iPhone si elle veut espérer regagner là-bas des parts de marché.

  • Post-infection : une évaluation de l'aide de produits de sécurité (Génération NT: logiciels)
    Nettoyage et récupération. Une évaluation de 15 suites et outils spécialisés de sécurité qui peuvent aider en cas d'infection par un malware.
  • ASUS Designo Curve MX34VQ Incoming: 34" Ultrawide Curved Display with Qi Charging (AnandTech)

    ASUS has started to ship its Designo Curve MX34VQ display that was originally announced in mid-2016. At present, a number of retailers are offering pre-orders on the monitor, starting that it is “coming soon." The monitor is based around a UWQHD-class panel and is equipped with a wireless Qi charging device as well as an audio sub-system co-developed with Harman Kardon. In addition, the display has a 100 Hz refresh rate, a feature that should appeal to gamers.

    The ASUS Designo Curve MX34VQ has a number of similarities with another ultrawide curved display with a Qi charger, the MX38VQ, which was introduced earlier this year. The two monitors share many design elements, such as ultra-thin bezels, a Harman Kardon-developed audio sub-system consisting of two 8 W speakers, a curved stand made of metal and plastic, and a Qi charger with acrylic elements and blue lighting. Where the two displays differ is in their panels, curvature and other specifications.

    The ASUS Designo Curve MX34VQ is based on a 34” VA panel with a 3440×1440 resolution (2.39:1 aspect ratio), offering a maximum brightness of 300 nits, a 3000:1 contrast ratio, a 100 Hz refresh rate, 178°/178° viewing angles, a 4 ms response time, and 1800R curvature. The panel can reproduce 16.7 million colors and appears to be a pretty typical sRGB gamut design. As for connectivity, the Designo Curve MX34VQ monitor has three HDMI 2.0 ports, a DisplayPort 1.2 port (PiP and PBP functions are supported), and a 3.5-mm audio jack.

    ASUS Designo Curve MX34VQ
    Panel 34" VA
    Resolution 3440 × 1440
    Refresh Rate 100 Hz
    Response Time 4 ms gray-to-gray
    Brightness 300 cd/m²
    Contrast 3000:1
    Viewing Angles 178°/178° horizontal/vertical
    Color Saturation 16.7 million colors (sRGB?)
    Pixel Pitch 0.2316 mm
    Pixel Density 110 ppi
    Inputs 1 x DisplayPort 1.2 (HDCP)
    3 x HDMI 2.0 (HDCP)
    Qi Wireless Charging 5W/1A with aurora lighting
    Audio 8 W × 2
    Harmon/Kardon
    Launch Price $799 (?)

    The ASUS Designo Curve MX34VQ can be pre-ordered from Amazon and B&H for $799, which seems to be its official price. If that does end up being the official price then it'll be a bit lower than I had initially expected, given the stylish design and rather decent specifications. For comparison, similar curved ultrawide monitors without Qi support have tended to retail for $899 and higher. In any case, the exact availability date is unknown, but with pre-orders opening up it's reasonable to assume that the MX34VQ will finally hit the shelves in the coming weeks.

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  • The OpenPOWER Saga Continues: Can You Get POWER Inside 1U? (AnandTech)

    When we saw that Tyan made a 1U server based upon this Habanero platform, that caught our eye. The power-hungry POWER8 inside a density optimized form factor? And they feed it with a PSU of "only" 750 W? Is that really a viable option?

    Today we'll be taking a loot at Tyan's GT75 system to find out the answer to that, and to see if a 1U configuration makes sense for a POWER8 system.

  • iPhone 6S: iOS 10.2.1 aurait réglé l'essentiel des problèmes d'extinction brutale (MacBidouille)

    Apple a fait face à des problèmes sur ses iPhone 6S, nombre de personnes s'étant plaintes que leur appareil puisse s'éteindre brusquement pendant leur utilisation.
    TechCrunch rapporte les propos d'Apple qui déclare que la mise à jour iOS 10.2.1 a réglé en grande partie ce problème, ayant réduit de 80% ces cas de figure. Sur l'iPhone 6, ces problèmes auraient reculé de 70%.
    La société a également ajouté dans cette version d'iOS du code permettant dans ces cas de redémarrer sans avoir à rebrancher l'appareil sur une source d'alimentation.

    Si vous êtes toujours touchés, il est maintenant conseillé de vous rapprocher d'Apple Care pour faire échanger votre batterie, potentiellement défectueuse.

  • Cloudflare victime d'une faille de sécurité (MacBidouille)

    Cloudflare est une société spécialisée dans la sécurisation de sites internet et en protègerait plusieurs millions.
    La société a rapporté avoir été victime d'une faille de sécurité, découverte récemment mais qui aurait pu être exploitée depuis le 22 septembre dernier avec un pic d'impact potentiel entre le 13 et le 18 février.
    Cette faille aurait permis de récupérer des donnés confidentielles sur les clients, mots de passe, jetons de connexion et données en temps réel.
    Ces données sensibles ont parfois été mises en cache par les moteurs de recherche, ce qui fait qu'elles puissent encore être récupérées même maintenant que la faille a été comblée.

    La société annonce qu'à sa connaissance il n'y a pas eu d'exploitation massive de cette faille.

  • Apple a cessé d'acheter des serveurs à Super Micro pour des raisons de sécurité (MacBidouille)

    Comme vous le savez, Apple est totalement sorti du marché des serveurs, sauf avec une version de macOS qui porte ce nom.
    Pour fournir ses centres de données elle faisait appel entre autres à Super Micro.

    Selon The Information la société a décidé de ne plus leur en acheter après avoir découvert un problème de sécurité sur au moins un de ces serveurs. Il ne s'agirait pas à proprement parler d'une faille, mais d'un problème assez sérieux pour mettre fin à ce partenariat.
    Apple a commenté de manière laconique l'information en disant prendre très au sérieux la sécurité des données de ses clients et surveiller de manière constante ses équipements pour combattre et prévenir les failles.

  • SilverStone Launches SST-TP01-M.2 Thermal Pads for M.2 SSDs (AnandTech)

    In a bit of offbeat news this afternoon, SilverStone has announced a set of thermal pads for M.2 SSDs, the SST-TP01-M.2. These pads are designed to eliminate (or at least reduce) throttling of modern, high-performance drives under high loads. The pads are made of silicone and Silverstone claims they can reduce temperature of SSDs by over 10°C.

    M.2 SSDs have a number of advantages over drives in traditional 2.5” form-factor: they are smaller, they are faster (because they use the PCIe interface with the NVMe protocol), they are (sometimes) cheaper to make, and so on. However, one of the main drawbacks of higher-end M.2 SSDs is the high heat dissipation of their controllers (and memory chips) despite their small form factor, which can lead to thermal throttling and reduced overall performance. Manufacturers have been aware of this for a bit now and have been addressing it in a couple of different ways. Plextor, for example, installs aluminum heat spreaders on their M8Pe drives, whereas Samsung’s latest HDDs come with other types of heat spreaders. However since not all SSD suppliers equip their products with sufficient cooling, SilverStone has developed an aftermarket thermal pad that should work with most drives.

    The SilverStone SST-TP01-M.2 thermal pads are made of electrically non-conductive silicone – a material that offers decent thermal conductivity (up to 4 W/m.k) – and can fit M.2 drives that are up to 110 mm long. The SST-TP01-M.2 package includes both 0.5 mm and 1.5 mm thick pads for accommodating different setups.

    According to SilverStone, usage of the thermal pads can reduce temperature of Samsung’s SM951 SSDs from 86°C to 71.4°C under high loads, thus ensuring they operate at peak performance more often. The actual performance of SilverSone’s thermal pads will heavily depend on the SSD and the surrounding system – the heat still needs to go somewhere – but there's some potential here as silicone heatpads are by no means a new thing in PC hardware and have proven themselves to be useful.

    SilverStone has already started to produce its M.2 thermal pads, and in Japan stores in the famous Akihabara district are already demonstrating them. Unfortunately, pricing has not yet been announced. But M.2 SSD owners who suffer from thermal throttling of M.2 SSDs will want to keep an eye on this.

  • AOC Expands AGON Family with Curved AG322QCX and AG272FCX 144 Hz Displays (AnandTech)

    AOC has introduced two new curved gaming monitors as part of the AGON family, the AG322QCX and the AG272FCX. The new monitors feature rather high refresh rates along with VESA’s Adaptive-Sync technology (which generally means support for AMD’s FreeSync). The displays have a number of similarities, but are aimed at different segments of the market, with varying prices and feature sets..

    The AOC AGON AG272FCX is the smaller of the two and uses a 27” VA panel with 1920×1080 resolution, whereas the AOC AGON AG322QCX is the larger one and features a 31.5” VA panel with 2560×1440 resolution. The monitors have 1800R curvature, a 16:9 aspect ratio, as well as refresh rates between 48 Hz and 144 Hz. The general specifications of the displays resembles those of many other gaming monitors: 250/300 nits brightness, 3000:1/2000:1 contrast ratio, 178°/178° viewing angles, 16.7 million colors (and the sRGB color gamut), a 4 ms response time (grey-to-grey) and so on. The monitors support VESA’s Adaptive-Sync technology, and I expect it's only a matter of time until AMD certifies them for FreeSync.

    As for connectivity, the AGON AG272FCX has a D-Sub(!), DisplayPort, and two HDMI inputs, whereas the AGON AG322QCX comes with two HDMI and two DisplayPort inputs. The smaller display also has a dual-port USB 3.0 hub as well as integrated 3 W stereo speakers, two logical features for an entry-level monitor. By contrast, the larger screen is a much more straightforward pure monitor, which is par for the course as higher-end monitors rarely ship with speakers since customers usually already have external speakers/headphones. A more important drawback is the lack of any HDCP support on the AG322QCX, which greatly limits the monitor's ability to be used with protected HD video content such as Blu-rays or Netflix streaming.

    AOC's AGON Curved 16:9 Displays
      AGON AG272FCX AGON AG322QCX
    Panel 27" VA 31.5" VA
    Native Resolution 1920 × 1080 2560 × 1440
    Maximum Refresh Rate 144 Hz
    Response Time 4 ms
    Dynamic Refresh Rate Adaptive-Sync (not yet FreeSync certified)
    Brightness 250 cd/m² 300 cd/m²
    Contrast 3000:1 2000:1
    Viewing Angles 178°/178° horizontal/vertical
    Curvature 1800R
    Pixel Pitch 0.3114 mm 0.2724 mm
    Pixel Density 82 ppi 93 ppi
    Anti-Glare Coating Yes
    Inputs 1 × DisplayPort (HDCP)
    1 × D-Sub
    2 × HDMI (HDCP)
    2× DisplayPort
    2 × HDMI
    USB Hub 2-port USB 3.0 hub -
    Audio 3 W × 2
    audio in/out ports
    -
    Power Consumption Idle: 0.5 W
    Operating: 47 W
    Idle: 0.5 W
    Operating: 40 W
    Launch Price £389 ($485) in the U.K. £519 ($647) in the U.K.

    When it comes to visual aesthetics, the new AGON displays feature ultra-thin bezels as well as an aggressive design that highlights their gaming nature. Furthermore, the monitors have four large LEDs with adjustable colors (red, green, blue) located on the back and two located on the bottom edges of the displays.

    The addition of these latest AGON displays brings AOC to a total of four curved monitors introduced under the brand in the last few months, joining the company's previously launched ultrawide curved monitors and making these the company's first curved 16:9 monitors. So it appears that AOC is pinning a lot of its hopes for the AGON brand on curved gaming screens with high refresh rates designed for gamers. 

    AOC’s AGON AG322QCX and AGON AG272FCX monitors will be available in May. The exact MSRPs of the displays in the U.S. and Continental Europe are unknown, but Hexus reports that in the U.K. they will cost £519 ($647) and £389 ($485) respectively.

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  • Samsung Announces Exynos 8895 SoC: 10nm, Mali G71MP20, & LPDDR4x (AnandTech)

    Even though Mobile World Congress doesn’t kick off for another few days, Samsung isn’t wasting any time in getting started. This morning the company is announcing their latest generation high-end ARM SoC, the Exynos 8895. Their first in-house 10nm SoC, the company isn’t talking about what it will go in, but based on the context of the announcement it’s a safe bet we’re looking at the SoC for at least some SKUs of the next Galaxy S phone.

    While Samsung has been in the SoC game with the Exynos series for a number of years now, it’s been in the last few years that they’ve really cemented their positon as a market leader at the high-end. Thanks in part to the company’s 14nm process, the Exynos 7420 proved to be a very capable and powerful SoC from the company. Last year Samsung followed that up with the Exynos 8890, which among other firsts marked Samsung’s entry into designing their own CPU cores with the M1.

    Now for 2017 Samsung wants to repeat their success over the past couple of years with the Exynos 9 Series 8895. As you can likely infer from the name, it’s not meant to be radically different from the preceding 8890, but there are still some pretty important changes here that should affect performance across the board.

    Samsung Exynos SoCs Specifications
    SoC Exynos 8895 Exynos 8890 Exynos 7420
    CPU 4x A53

    4x Exynos M2(?)
    4x A53@1.6GHz

    4x Exynos M1 @ 2.3GHz
    4x A53@1.5GHz

    4x A57@2.1GHz
    GPU Mali G71MP20 Mali T880MP12
    @ 650MHz
    Mali T760MP8
    @ 770MHz
    Memory
    Controller
    2x 32-bit(?)
    LPDDR4x
     
    2x 32-bit
    LPDDR4 @ 1794MHz

    28.7GB/s b/w
    2x 32-bit
    LPDDR4 @ 1555MHz

    24.8GB/s b/w
    Storage eMMC 5.1, UFS 2.1 eMMC 5.1, UFS 2.0 eMMC 5.1, UFS 2.0
    Modem Down: LTE Cat16
    Up: LTE Cat13
    Down: LTE Cat12
    Up: LTE Cat13
    N/A
    ISP Rear: 28MP
    Front: 28MP
    Rear: 24MP
    Front: 13MP
    Rear: 16MP
    Front: 5MP
    Mfc.
    Process
    Samsung
    10nm LPE
    Samsung
    14nm LPP
    Samsung
    14nm LPE

    The big deal for Samsung of course is that the Exynos 8895 is their first 10nm SoC, designed by Samsung LSI and fabbed by Samsung. Semantics of what is or isn’t 10nm aside, Samsung’s 10nm LPE process is cutting-edge for a mobile SoC, and relative to the current 14nm process offers better density and better performance characteristics. Samsung has talked about the process a bit in the past, and for the Exynos 8895 announcement they are reiterating that the 10nm LPE process offers “up to 27% higher performance while consuming 40% less power” relative to 14nm. However this may be in error in phrasing on Samsung's part, as last year it was "27-percent higher performance or 40-percent lower power consumption", which is a more realistic statement. Either way, for 8895 in particular, Samsung isn’t talking about performance quite yet.

    Diving into the specs, the CPU situation looks a great deal like the previous 8890. Samsung has gone with 8 cores – 4 high-power, 4 low-power – with a mix of custom and licensed silicon. The high-power cores are composed of what Samsung is calling a “2nd generation” custom CPU core. This would presumably be a newer iteration of the M1 (so the M2?), but Samsung isn’t offering up much in the way of details at this time over what’s changed from the M1. What we do know is that Samsung is touting that it offers both better performance and improved energy efficiency. Meanwhile low-power work is once again being provided by ARM’s Cortex-A53. (ed: which on 10nm, must be absolutely tiny, considering that a core was sub-1mm2 on 14nm)

    Meanwhile on the GPU side, Samsung has significantly upgraded their graphics capabilities by tapping ARM’s latest-generation Mali-G71 GPU in an MP20 configuration. Based on ARM’s new Bifrost GPU architecture, the G71 radically overhauls the internal workings of the GPU to match the contemporary thread level parallelism (TLP)-centric nature of desktop GPUs and modern workloads. ARM has previously discussed that they expect G71-based devices to offer around 50% better graphics performance than T880 devices, and Samsung is going one step further by touting it as 60% faster performance.

    In another first for Samsung, the 8895 is also their first Heterogeneous System Architecture (HSA) compliant SoC. This requires that the CPU, GPU, and interconnect all support HSA, and indeed all of the necessary pieces have come together for 8895. We’ve previously seen that the Mali-G71 GPU is HSA-compliant, and meanwhile for the 8895 Samsung has rolled out a new version of their interconnect (the Samsung Coherent Interconnect) to support HSA. This isn’t a development that I expect will have immediate ramifications, but HSA is ultimately at the core of making it easier for developers to program applications that use the GPU in a compute context, thanks to the common (and common-sense) architecture rules for HSA.

    To feed the resulting beast, Samsung has added support for LPDDR4x memory. An extension of the original LPDDR4 standard, LPDDR4x is designed to reduce DRAM power consumption by up to 20% by reducing the output driver power (I/O VDDQ voltage) by 45%, from 1.1 V to 0.6 V. LPDDR4x memory has just started shipping, so along with the previously announced Snapdragon 835, the Exynos 8895 is the other high-performance SoC coming out this year to support the new memory.

    The Exynos 8895 is also getting an upgraded ISP. The latest ISP supports 28MP for both the front and rear cameras, while a bit more nebulously, Samsung’s spec sheet also lists support for “28MP+16MP Dual Camera” mode, an unsurprising development given the recent popularity of dual camera phone designs. Diving a bit deeper, we find that the 8895’s ISP is actually two ISPs: a high-performance ISP and a low-power ISP, with the low-power ISP presumably providing the aforementioned 16MP capability. Samsung is touting this combination as allowing them to offer dual camera functionality while still keeping power consumption in check.

    On the flip slide of the coin, the Exynos 8850 also gets a new version of Samsung’s video decode block, which the company calls their Multi-Format Codec (MFC). This latest MFC supports all the bells and whistles you’d expect, with both HEVC and VP9 decoding up to 4kP120. Samsung’s press release also briefly mentions a “video processing technology that enables a higher quality experience by enhancing the image quality” that’s capable of “enhancing the image quality of a specific portion that is perceived more sensitive to the human eye.” Given the VR applications – and Samsung wants to be able to do 4K VR –  this sounds a bit like a variation on the idea of foveated rendering, but there aren’t any further details on the technology at this time.

    Also appearing for the first time on the Exynos 8895 is Samsung’s Cat16 LTE modem design. With their modem Samsung is using 5x Carrier Aggregation to achieve up to 1Gbps down, while uploading is rated at LTE Cat 13, using 2 carriers to get 150Mbps up. What’s notable here is that, as best as I can tell, this is the first modem using 5x CA; Qualcomm’s equivalent modem, the X16, uses 3 or 4x CA depending on the scenario. Unfortunately with the limited details Samsung offers right now, I’m not sure whether they have to use 5x CA to get Cat 16 bandwidth, or this is just another optional mode.

    Finally, the Exynos 8895 also includes what Samsung is calling an “enhanced security sub-system with a separate security processing unit” for use with user authentication, mobile payments, and the like. Based on Samsung’s description this sounds a heck of a lot like Apple’s Secure Enclave, which would be a very welcome development, as in Apple’s case it has made their phones a lot harder to break into.

    Wrapping things up, along with today’s product announcement of the Exynos 8895, Samsung is also announcing that the SoC is in mass production; and indeed I would be surprised if this isn’t the SoC they announced back in October, which would mean it’s been in production for some time now. We still don’t know when we’re going to see the next Samsung Galaxy S phone, but given how Samsung is announcing the SoC in this fashion, clearly it’s going to be sooner than later. In the meantime, hopefully we’ll get some additional SoC details next week at MWC.

  • Windows 10 : déverrouiller son PC avec un smartphone Samsung (Génération NT: logiciels)
    La mise à jour Creative Update de Windows 10 devrait permettre d'ouvrir un peu plus l'OS de Microsoft aux éditeurs tiers, et de nouvelles interactions sont à prévoir entre certains accessoires et les ordinateurs.
  • Un crack est un ransomware mal codé pour macOS (Génération NT: logiciels)
    Les ransomwares prenant pour cible l'ordinateur Mac ne sont pas légion. Un nouveau nuisible tente maladroitement l'expérience.
  • Toshiba Samples 64-Layer 512 Gb BiCS 3D NAND, Announces 1 TB BGA SSD (AnandTech)

    Toshiba on Wednesday said that it had begun to sample its latest BiCS 3D NAND flash memory chips with 64 word layers and 512 Gb capacity. A co-development project with Western Digital, the two companies intend to produce the new ICs (integrated circuits) in high volume sometimes in the second half of this year. Among the first products to use the new chips will be Toshiba’s BGA SSD with 1 TB capacity.

    Looking at the specifications, Toshiba's 512 Gb (64 GB) 64-layer BiCS 3D NAND will be TLC-based, with the use of TLC being unsurprising here as all makers of non-volatile memory nowadays concentrate on TLC ICs for SSDs. Toshiba as well as its fab and development partner (Western Digital) has not formally revealed the interface speed of their new 512 Gb 3D NAND ICs nor the number of planes per IC, but these are details that the companies are probably going to share when they are ready to ship such devices in high volume (or simply decide to publish their ISSCC presentation from earlier this month).

    In fact, a 64-layer 3D TLC BiCS NAND chips per se are not a 2017 breakthrough. Western Digital, has been using its 64-layer 3D TLC NAND devices for actual products (e.g., removable media) since November or December. However, those 64-layer 3D TLC NAND ICs have capacity of 256 Gb, whereas the new chips can store 512 Gb of data. Toshiba itself says that its 256 Gb 64-layer BiCS ICs are in high-volume production today.

    Toshiba and Western Digital said that high-volume manufacturing of their 512 Gb 64-layer devices will commence in the second half of 2017 in Yokkaichi, Japan. The two companies said that the new ICs will help them to address various retail, mobile and data center applications. The latter indicates that the devices will be used not only for removable media and mobile storage, but also for high-end enterprise-class SSDs.

    Meanwhile, Toshiba’s BGA SSDs will be among the first to use the company’s new memory devices. The company plans to produce a BGA drive (as well as M.2 modules based on such BGA devices) with 1 TB capacity featuring 16 chips. Such SSDs are designed for various mobile and UCFF (ultra-compact form-factor) PCs and enable to reduce their thickness and overall footprint as well as improve battery life. Samples of the BGA drives will be available in April, whereas mass production will start sometimes in 2H 2017.

    Note: Images are for illustrative purposes only.

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  • Un SSD de 24 TB PCIe à la consommation record (MacBidouille)

    NGD Systems vient d'annoncer la disponibilité d'une carte PCIe NVMe d'une capacité record de 24 TB mais aussi d'une consommation elle même record, à savoir de 0,65 W/TB.

    Utilisant des composants 3D TLC NAND, cette annonce nous prouve une fois de plus l'essor de cette technologie qu'est le SSD.

    On se prend donc à rêver d'un [nouveau] MacPro, équipé de 2 voire 3 slots PCIe, ce qui pourrait porter la capacité de stockage à 72 TB (avec 3 cartes comme celle ci) !

    Le prix n'est - malheureusement - pas encore disponible : prévoyez un gros chèque au passage !!!



  • Intel Launches Atom C3000 SoCs: Up to 16 Cores for NAS, Servers, Vehicles (AnandTech)

    Intel this week formally launched its Atom C3000-series processors (formerly codenamed Denverton). The new chips are designed for inexpensive storage servers, NAS applications, as well as autonomous vehicles. The C3000 series features up to 16 low power x86 cores, integrated 10 GbE, rather rich I/O capabilities, as well as Intel’s Quick Assist technology.

    Intel’s Atom C3000 processors are based on Intel's current-generation Goldmont Atom microarchitecture, with SKUs offering between 2 and 16 cores and clockspeeds up to 2.2 GHz. Being designed for primarily for NAS and servers, the Atom C3000 SoCs fully support Intel’s VT-d hardware virtualization, Quick Assist compression/encryption technology (up to 20 Gbps throughput) as well as up to 64 GB of single-channel DDR4-1866 or DDR3L-1600 ECC memory. When it comes to I/O, the Atom C3000 features a PCIe 3.0 x16 controller (with x2, x4 and x8 bifurcation), 16 SATA 3.0 ports, four 10 GbE controllers, and four USB 3.0 ports.

    Due to its rich I/O capabilities, the Atom C3000 is aimed at a wide range of devices, including servers/NAS (which they were originally designed for) as well as emerging applications like IoT and autonomous vehicles. For example, PCIe 3.0 bus may be used to connect various controllers, sensors and co-processors (e.g., a GPU) to the SoC. Last year we examined one of the server-oriented C3000-based designs that is going to be one of the many devices featuring the new chips.

    Intel will offer various versions of its Atom C3000 SoCs with different TDPs starting at 8.5 W. The chips will support extended temperature ranges for storage, industrial and autonomous driving environments. In addition, Intel says that the processors feature “automotive-grade safety and security features,” but does not elaborate (generally, ECC, Quick Assist, virtualization, etc. can be considered as safety and security features too).

    So far, Intel has only announced one Atom C3000-series SoC: the Atom C3338, which has two cores running at 1.5 – 2.2 GHz, 4 MB cache, 10 PCIe 3.0 lanes, 10 SATA 3.0 ports, four Gigabit Ethernet ports and so on. The chip has 9 W TDP and costs $27 in commercial quantities and is expected to be available to Intel’s customers already this quarter.

    Intel’s partners have been testing the Atom C3000 processors since at least early 2016. The chipmaker expects its allies to start launching actual products based on the chips by mid-2017. In addition to the SoCs themselves, Intel will also supply a data plane development kit (DPDK) as well as a storage performance development kit (SPDK) to assist its partners in development of networking and storage applications.

    Related Reading:

  • Performance & Battery Life Report: Xiaomi Redmi Note 4 with MediaTek Helio X20 (AnandTech)

    As a member of Xiaomi’s more affordable Redmi series, the Note 4 does not have a curved screen, a ceramic body, or the latest flagship hardware like Xiaomi’s more expensive models, but it does pack a 5.5-inch IPS LCD display, a rear-mounted fingerprint sensor, and a 13MP camera with PDAF into a solid-feeling aluminum chassis. This report is more concerned with its internal hardware, however, focusing on the Redmi Note 4’s system performance, gaming performance, and battery life.

  • Windows 10 : l'application Courrier avec boîte de réception Prioritaire (Génération NT: logiciels)
    Avec en vedette la boîte de réception Prioritaire, les applications Courrier et Calendrier de Windows 10 bénéficient de plusieurs nouveautés et améliorations.
  • Apple: le nouveau quartier général s'appellera Apple Park (MacBidouille)

    Apple a officialisé le nom de son futur quartier général. Il s'appellera Apple Park et commencera à se remplir au mois d'avril. Dans les 6 mois suivants, il verra s'installer 12 000 personnes de la société.
    Chose importante, il sera équipé d'un auditorium de 1 000 places, qui deviendra certainement un haut lieu des annonces de la société et qui a été baptisé du nom de Steve Jobs en sa mémoire.

    [MàJ] On apprend, sans grande surprise, que Tim Cook va aussi y installer son nouveau bureau.

  • L'action Apple vogue de records en records (MacBidouille)

    Le cours de l'action Apple ne cesse de grimper et atteint au moment où nous écrivons ces lignes, avec 137,11$.
    Cette hausse est en bonne partie liée aux multiples rumeurs sur les prochains iPhone, qui décrivent une rupture technologique importante et de nouvelles fonctions avancées.
    Cela a conduit bien des analystes à relever leurs prévisions de cours de l'action et à conseiller son achats. Ils tablent en effet sur un futur retour à une forte croissance du produit phare d'Apple.

    Il faut dire que l'idée d'avoir un mobile Apple doté d'une dalle OLED recouvrant toute sa surface et d'une nouvelle caméra frontale capable de gérer la profondeur ont commencé à redonner envie même aux plus blasés des smartphones Apple d'en acquérir un dans le futur.

  • AMD annonce le prix de ses processeurs Ryzen (MacBidouille)

    AMD a convoqué la presse pour le lancement de ses processeurs Ryzen.

    Trois modèles seront largement disponibles à partir du 2 mars prochain et sont en précommande immédiatement. Ces trois modèles seront dotés de 8 cœurs physiques et 16 logiques et auront 16 Mo de cache de niveau 4 partagée entre eux.
    Le plus haut de gamme, le R7 1800X, aura une fréquence de base à 3,6 GHz et un mode turbo à 4 GHz pour un TDP de 95W. Il sera comparé au processeur Intel i7-6900K, Broadwell de 3,2 GHz (turbo à 3,7 Ghz). On n'est donc pas dans une configuration où AMD peut encore lutter à fréquence égale, mais pas loin. En revanche au niveau du prix il n'y a pas photo. Le processeur Intel coûte 1050$ et celui d'AMD sera lancé à 499$, moins de la moitié.
    AMD a annoncé que dans ce comparatif, son processeur a battu celui d'Intel en encodage vidéo avec Handbrake et fait mieux dans certains jeux très gourmands.

    Dans un registre similaire, le processeur Intel est bien plus rapide dans l'utilisation des applications monothreadées, mais l'AMD s'avérait explosif quand on sollicite tous les cœurs, jusqu'à +46% de puissance.

    Les deux autres produits lancés seront le 1700X 3,4 GHz (turbo à 3,8 GHz) pour 399$ et le 1700 3 GHz (turbo à 3,3 GHz) pour 329$. Tous auront des coefficients multiplicateurs débloqués.

    Après de très longues années à oublier, AMD semble être enfin sorti de son ornière. C'est une excellente nouvelle pour les consommateurs, qui devraient voir baisser le prix des processeurs et repartir la course à la puissance en pause depuis aussi longtemps.


  • Apple: le nouveau quartier général s'appellera Apple Park (MacBidouille)

    Apple a officialisé le nom de son future quartier général. Il s'appellera Apple Park et commencera à se remplir au mois d'avril. Dans les 6 mois suivants, il verra s'installer 12000 personnes de la société.
    Chose importante, il sera équipé d'un auditorium de 1000 places qui deviendra certainement un haut lieu des annonces de la société et qui a été baptisé du nom de Steve Jobs en sa mémoire.

  • AMD Launches Ryzen: 52% More IPC, Eight Cores for Under $330, Pre-order Today, On Sale March 2nd (AnandTech)

    The biggest x86 launch for AMD in five years is today: Ryzen is here. As always before a major launch, AMD gives a ‘Tech Day’ for relevant press and analysts, and through this event AMD’s CEO, Dr. Lisa Su lifted the lid on one of the most anticipated products in the semiconductor industry. AMD knows how to control the level of enthusiasm for its fans, and today is the end result, with processors going on pre-order from major retailers today at 1pm EST, ready for a general hard launch on March 2nd.

    In a similar vein to launches of recent smartphones, AMD is doing a staggered announcement/launch with the products on their new microarchitecture. Where Samsung/Apple might give all the details for a product a few weeks before it’s available to buy, today on February 22nd marks the day where AMD is giving consumers information about Ryzen, and specifically the Ryzen 7 family of eight-core products. All the information today is from AMD, and AMD’s internal testing, and pre-orders also start from today for users ready to put down their money for a launch day part. Reviews of the CPUs, as well as when the CPUs will ship to customers, is on March 2nd. This also happens to be right in the middle of two annual shows, Game Developer Conference (GDC) and Mobile World Congress (MWC), making the time between receiving pre-launch samples and being able to provide independent verification of AMD’s performance claims relatively frantic. We’ll do our best!

    The Ryzen Family

    With a new processor launch, naming the parts and positioning them within the market is critical. So with Ryzen, the processor stack will be split into three based on performance and price: Ryzen 7 at the high end, Ryzen 5 in the middle, and Ryzen 3 for more price-conscious consumers. Both Ryzen 5 and Ryzen 3 are set to be launched later, and Ryzen 7 is the first portion of the family to be released.

    Ryzen 7 will have three CPUs to start, all having eight cores and supporting simultaneous multi-threading:

    • Ryzen 7 1800X: 8C/16T, 3.6 GHz base, 4.0 GHz turbo, 95W, $499
    • Ryzen 7 1700X: 8C/16T, 3.4 GHz base, 3.8 GHz turbo, 95W, $399
    • Ryzen 7 1700: 8C/16T, 3.0 GHz base, 3.7 GHz turbo, $329

    Ryzen 7 1800X will be the high-end part, featuring a base clock of 3.6 GHz and a turbo of 4.0 GHz, within a TDP of 95W, and for $499. Next to this is Ryzen 7 1700X, launching at $399, with a base/turbo of 3.4/3.8 GHz. The final part for the launch is the Ryzen 7 1700, providing eight cores and sixteen threads for $329 at 3.0/3.7 GHz frequencies.

    Processors will initially be available for pre-order from 185 retailers and OEMs worldwide, either as individual parts or pre-built systems.

    What, not 40% IPC? 52% IPC??

    Enthusiasts and analysts use the term IPC, or ‘Instructions Per Clock’, as a measure of how much the underlying microarchitecture improves from generation to generation. Two decades ago, a good design on a smaller node could net a healthy double-digit gain, whereas in recent years 5-10% gain has become the norm. When AMD initially announced that the new Zen microarchitecture they were developing was aiming for a 40% IPC gain, despite the low IPC they were starting from, users remained skeptical. AMD rehired Jim Keller to work alongside long-term AMD architect Mike Clark and produce a team with several goals in mind: high-performance x86, simultaneous multithreading, and a product to be relevant in the computing, PC, server and mobile space again. So despite this, 40% IPC always seemed a somewhat lofty goal, because Bulldozer was so underwhelming, and despite this low starting point. For the Ryzen launch today, AMD is stating that the final result of that goal is a 52% gain in IPC.

    This is something we will need to test in due course!

    The Ryzen Silicon, and the Future

    AMD pointed out that the new 8-core silicon design runs 4.8 billion transistors and features 200m of wiring. Through previous announcements we’ve examined parts of the microarchitecture including cache sizes, threading, front-end/back-end design, and so on.

    AMD Zen Microarchiture Part 2: Extracting Instruction-Level Parallelism
    AMD Gives More Zen Details: Ryzen, 3.4 GHz+, NVMe, Neural Net Prediction, & 25 MHz Boost Steps

    AMD’s CEO was keen to point out that this is a from-scratch design for AMD, using the knowledge gained from features developed for previous products but ultimately under the hood it looks like ‘a typical x86 high-performance core’, with AMD-specific features and tweaks. We were told that AMD’s roadmap extends into the multi-year range, so while the focus for 2017 will be on this family of products, back at HQ the next two generations are in various stages of development.

    BENCHMARKS PLEASE

    So despite the 82+ motherboards going to be available, 19 initial PC system builders moving into 200+ through the first half of 2017, the big question on everyone’s lips is how exactly does it perform?

    Well, AMD gave us the following numbers:

    AMD's benchmarks showed that the top Ryzen 7 1800X, compared to the 8-core Intel Core i7-6900K, both at out-of-the-box frequencies, gives an identical score on the single threaded test and a +9% in the multi-threaded test. AMD put this down to the way their multi-threading works over the Intel design. Also, the fact that the 1800X is half of the price of the i7-6900K.

    In a similar vein, again with the Cinebench 15 multi-threaded test, the Ryzen 7 1700X scores over and above the Core i7-6800K (its price competition) and higher than the Core i7-6900K which costs 2.5 times as much.

    We’ll tell you what our benchmarks say, with official retail processors. But you will have to wait until March 2nd. Sorry.

  • Microsoft Edge et IE : une mise à jour critique pour Flash Player (finalement) (Génération NT: logiciels)
    Le report du Patch Tuesday de février à mars a finalement une exception. Microsoft a décidé de ne pas attendre pour Flash Player, et donc pour ses navigateurs Microsoft Edge et Internet Explorer sur Windows 10 et 8.1.
  • Apple rachète le domaine iCloud.net (MacBidouille)

    Apple a racheté le nom de domaine iCloud.net, qui conduisait auparavant vers un réseau social asiatique. Ce dernier a annoncé qu'il fermera à la fin du mois.
    Apple en est maintenant l'officiel détenteur et la société n'a pas voulu commenter l'information et surtout rapporter le coût de cette opération. Il se dit qu'elle aurait pour cela déboursé 1,5 millions de dollars.

  • Des problèmes avec les claviers des MacBook Pro 2016 (MacBidouille)

    Avec son MacBook Pro 2016, Apple a installé sur cette gamme le même clavier que sur les MacBook, plus fin, doté d'un nouveau système de pression des touches appelé papillon.
    Nombre de personnes n'ont pas apprécié cette nouvelle version dont la course des touches est plus courte et le bruit désagréable.
    9to5Mac rapporte maintenant que de plus en plus de personnes font face à des problèmes mécaniques. On parle ici de touches devenues non fonctionnelles ou dans d'autres cas de dysfonctionnements entrainant des actions multiples lors d'une simple pression.

    On ignore l'étendue de ce problème mais il semble bel et bien que cette machine soit mal née.

  • Intel lance de nouveaux modem 4G plus rapides (MacBidouille)

    Une bonne partie des iPhone 7, dont tous ceux commercialisés en Europe, sont dotés de modems 4G Intel, des XMM 7480.
    C'était la première fois depuis longtemps qu'Apple faisait des infidélités à Qualcomm.
    Toutefois, il s'est dit qu'Apple avait ralenti les modems Qualcomm pour ne pas que l'on puisse voir que ceux d'Intel étaient significativement moins rapides en 4G.
    Ce ne sera probablement plus le cas avec les prochains iPhone. En effet, Intel vient de lancer un nouveau modèle de modem, le XMM 7560.

    Ses performances annoncées sont en nette hausse, équivalentes à celle des puces Qualcomm,

    avec un débit maximum théorique de 1 Gbit/s.Outre cela, il supporte 35 plages de fréquence comprises entre 700 MHz et 6 GHz, certainement de quoi voir Apple basculer totalement vers ce modèle alors que la société est en procédure contre Qualcomm.

  • Verizon rachète Yahoo pour 4,4 milliards de dollars (MacBidouille)

    Après bien des hésitations suite aux piratages massifs de Yahoo, Verizon a fini par trouver un accord pour son rachat.
    Cela lui coûtera 4,48 milliards de dollars, 350 millions de moins que prévu avant ces affaires.
    Autre point important né de cette affaire de piratage, contractuellement, Verizon, bien que rachetant Yahoo, n'aura aucune responsabilité dans les affaires précédant ce rachat.

    Ce rachat sera finalisé durant le second trimestre 2017.

  • Windows 10 : une deuxième mise à jour majeure pour 2017 (Génération NT: logiciels)
    Microsoft a bel et bien prévu deux mises à jour majeure pour Windows 10 cette année. La Creators Update, et une autre vers fin 2017.
  • L'iPhone OLED pourrait avoir une caméra frontale révolutionnaire (MacBidouille)

    Ming-Chi Kuo, décrié analyste de KGI (pas forcément cette fois), annonce que l'iPhone OLED pourrait avoir une caméra frontale révolutionnaire capable, couplée à un capteur infrarouge, de permettre d'obtenir une vraie image en profondeur.
    Elle permettrait de réaliser des scans biométriques de visage, d'iris mais aussi de prendre des selfies "3D".
    Elle utilisera des algorithmes développés par l'ancienne équipe de PrimeSense qui a atterri chez Apple après le rachat de la société en 2013.
    Les infrarouges seront générés par une diode laser à cavité verticale développée par Lumentum tandis que l'appareil photo aura un second capteur de 1,4 millions de pixels capables de capter les infrarouges.

    Pour une fois, ces rumeurs donnent envie d'en savoir plus, et de voir en action un tel appareil.

Quand on fera danser les couillons,
tu ne seras pas à l'orchestre.
-+- Marcel Pagnol -+-